The first level: Inspection on packaging and label

 (checking if the packing conform with MSL level standa  rds and Label if originality or not)

 The second level: Visual inspection on actual body

 (Inspect whether the chip is brand new, refurbished, and whether the pins are coated with tin, oxidized, etc.)

 The third level : X-ray, Decapsulation, electrical pe rformance testing

 (Detection of internal cracks and flaws in metal materials, plastic materials and electronic components)