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  • image of IC Sockets>123-93-950-41-001000
  • image of IC Sockets>123-93-950-41-001000
Model 123-93-950-41-001000
Product Category IC Sockets
Manufacturer Mill-Max
Description CONN IC DIP SOC
Encapsulation -
Package Tube
RoHS Status
Price: $23.9300
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56

$23.9300

$1,340.0800

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image of IC Sockets>81863
81863
Model
81863
Product Category
IC Sockets
Manufacturer
Mill-Max
Description
CONN IC DIP SOC
Encapsulation
-
Package
Tube
lang_roHSStatusStatus
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrMill-Max
Series123
PackageTube
Product StatusACTIVE
FeaturesOpen Frame
Mounting TypeThrough Hole
TypeDIP, 0.9" (22.86mm) Row Spacing
Operating Temperature-55°C ~ 125°C
Number of Positions or Pins (Grid)50 (2 x 25)
TerminationWire Wrap
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass Alloy
Termination Post Length0.510" (12.95mm)
Current Rating (Amps)3 A
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