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Hi-tech circuit Group

Product Details
  • image of Solderless Breadboards>BB630
  • image of Solderless Breadboards>BB630
Model BB630
Product Category Solderless Breadboards
Manufacturer BusBoard Prototype Systems
Description WHITE 630-POINT
Encapsulation -
Package Bag
RoHS Status 1
Price: $7.0000
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image of Solderless Breadboards>19200401
19200401
Model
19200401
Product Category
Solderless Breadboards
Manufacturer
BusBoard Prototype Systems
Description
WHITE 630-POINT
Encapsulation
-
Package
Bag
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrBusBoard Prototype Systems
Series-
PackageBag
Product StatusACTIVE
Size / Dimension6.50" x 0.35" (165.1mm x 8.9mm)
TypeTerminal Strip (No Frame)
Number of Terminal Strips1
Number of Tie Points (Total)630
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