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Hi-tech circuit Group

Product Details
  • image of Solderless Breadboards>BB830
  • image of Solderless Breadboards>BB830
Model BB830
Product Category Solderless Breadboards
Manufacturer BusBoard Prototype Systems
Description WHITE 830-POINT
Encapsulation -
Package Bag
RoHS Status 1
Price: $8.5000
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image of Solderless Breadboards>19200392
19200392
Model
19200392
Product Category
Solderless Breadboards
Manufacturer
BusBoard Prototype Systems
Description
WHITE 830-POINT
Encapsulation
-
Package
Bag
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrBusBoard Prototype Systems
Series-
PackageBag
Product StatusACTIVE
Size / Dimension6.50" x 0.35" (165.1mm x 8.9mm)
Wire Gauge21 AWG ~ 26 AWG
TypeTerminal Strip (No Frame)
Number of Terminal Strips1
Number of Distribution Buses2
Number of Tie Points (Total)830
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