Language:en
  • zh-cn
  • en

Hi-tech circuit Group

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FET1012A-C 10512MOE01IA11
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FET1012A-C 10512MOE01IA11
Model FORLINX-FET1012A-C 10512MOE01IA11
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
Description NXP LS1012ASOM,
Encapsulation -
Package Tape & Box (TB)
RoHS Status 1
Price: $63.0000
Enter Quantity

Quantity

Price

Total Price

1

$63.0000

$63.0000

Obtain quotation information
image of Microcontrollers, Microprocessor, FPGA Modules>21813829
21813829
Model
21813829
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Forlinx Embedded
Description
NXP LS1012ASOM,
Encapsulation
-
Package
Tape & Box (TB)
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 160
Size / Dimension1.770" L x 1.570" W (45.00mm x 40.00mm)
Speed1.0GHz
RAM Size512MB
Operating Temperature-40°C ~ 80°C
Module/Board TypeMPU
Core ProcessorARM® Cortex®-A53
Flash Size8GB eMMC, 16Mb QSPI
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
852-9298 7121

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0