Language:en
  • zh-cn
  • en

Hi-tech circuit Group

Product Details
  • image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
  • image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
Model FORLINX-OKT507-C 152GSE8GIA10I11
Product Category Embedded MCU, DSP Evaluation Boards
Manufacturer Forlinx Embedded
Description ARM DEVELOPMENT
Encapsulation -
Package Tape & Box (TB)
RoHS Status 1
Price: $165.0000
Enter Quantity

Quantity

Price

Total Price

1

$165.0000

$165.0000

Obtain quotation information
image of Embedded MCU, DSP Evaluation Boards>21691169
21691169
Model
21691169
Product Category
Embedded MCU, DSP Evaluation Boards
Manufacturer
Forlinx Embedded
Description
ARM DEVELOPMENT
Encapsulation
-
Package
Tape & Box (TB)
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
TypeMPU
ContentsBoard(s), Accessories
Core ProcessorARM® Cortex®-A53
Utilized IC / PartAllwinner T507
PlatformFORLINX-OKT507-C Development Board
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
852-9298 7121

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0