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Hi-tech circuit Group

Product Details
  • image of Solder Stencils, Templates>IPC0006-S
  • image of Solder Stencils, Templates>IPC0006-S
Model IPC0006-S
Product Category Solder Stencils, Templates
Manufacturer Chip Quik, Inc.
Description QFN-16 STENCIL
Encapsulation -
Package Bulk
RoHS Status 1
Price: $11.5900
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image of Solder Stencils, Templates>5014923
5014923
Model
5014923
Product Category
Solder Stencils, Templates
Manufacturer
Chip Quik, Inc.
Description
QFN-16 STENCIL
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
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TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesProto-Advantage IPC
PackageBulk
Product StatusACTIVE
MaterialStainless Steel
Pitch0.020" (0.50mm)
TypeQFN/LFCSP
Inner Dimension0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions16
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