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Hi-tech circuit Group

Product Details
  • image of Solder Stencils, Templates>IPC0082-S
  • image of Solder Stencils, Templates>IPC0082-S
Model IPC0082-S
Product Category Solder Stencils, Templates
Manufacturer Chip Quik, Inc.
Description QFN-20 0.5 MM P
Encapsulation -
Package Bulk
RoHS Status 1
Price: $11.5900
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image of Solder Stencils, Templates>5015030
5015030
Model
5015030
Product Category
Solder Stencils, Templates
Manufacturer
Chip Quik, Inc.
Description
QFN-20 0.5 MM P
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
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TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesProto-Advantage IPC
PackageBulk
Product StatusACTIVE
MaterialStainless Steel
Pitch0.020" (0.50mm)
TypeQFN/LFCSP
Inner Dimension0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad0.098" L x 0.098" W (2.50mm x 2.50mm)
Number of Positions20
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