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Hi-tech circuit Group

Product Details
  • image of Microprocessors>R8A774A3HA01BG#UV
  • image of Microprocessors>R8A774A3HA01BG#UV
Model R8A774A3HA01BG#UV
Product Category Microprocessors
Manufacturer Intersil (Renesas Electronics Corporation)
Description SOC RZ/G2M HDMI
Encapsulation -
Package Tray
RoHS Status 1
Price: $104.5400
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image of Microprocessors>21409361
21409361
Model
21409361
Product Category
Microprocessors
Manufacturer
Intersil (Renesas Electronics Corporation)
Description
SOC RZ/G2M HDMI
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrIntersil (Renesas Electronics Corporation)
SeriesRZ/G2M
PackageTray
Product StatusACTIVE
Package / Case1022-BFBGA, FCBGA
Mounting TypeSurface Mount
Speed1.2GHz, 1.5GHz
Operating Temperature-40°C ~ 85°C
Core ProcessorARM® Cortex®-A53, ARM® Cortex®-A57
Voltage - I/O3.3V
Supplier Device Package1022-FCBGA (29x29)
Ethernet10/100/1000Mbps (1)
USBUSB 2.0 OTG (2), USB 3.0 (1)
Number of Cores/Bus Width4, 2 Core, 64-Bit
Co-Processors/DSPARM® Cortex®-R7
RAM ControllersLPDDR4
Graphics AccelerationYes
Display & Interface ControllersHMI
Security FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Additional InterfacesCANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
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