Language:en
  • zh-cn
  • en

Hi-tech circuit Group

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0817-01-4BE21-A
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0817-01-4BE21-A
Model TE0817-01-4BE21-A
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MPSOC MODULE WI
Encapsulation -
Package Bulk
RoHS Status 1
Price: $953.0000
Enter Quantity

Quantity

Price

Total Price

1

$953.0000

$953.0000

Obtain quotation information
image of Microcontrollers, Microprocessor, FPGA Modules>20418023
20418023
Model
20418023
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MPSOC MODULE WI
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesZynq® UltraScale+™
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 240
Size / Dimension2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size4GB
Operating Temperature0°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorZynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size128MB
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
852-9298 7121

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0