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  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0821-01-3AE31PA
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0821-01-3AE31PA
Model TE0821-01-3AE31PA
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MPSOC MODULE WI
Encapsulation -
Package Bulk
RoHS Status 1
Price: $571.0000
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image of Microcontrollers, Microprocessor, FPGA Modules>20418004
20418004
Model
20418004
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MPSOC MODULE WI
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesTE0823
PackageBulk
Product StatusACTIVE
Connector Type2 x 100 Pin
Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size4GB
Operating Temperature0°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorZynq UltraScale+ XCZU3CG-1SFVC784E
Co-ProcessorARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size128MB
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