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  • image of System On Chip (SoC)>XCVM1502-2MSEVFVC1760
  • image of System On Chip (SoC)>XCVM1502-2MSEVFVC1760
Model XCVM1502-2MSEVFVC1760
Product Category System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSALPRIME
Encapsulation -
Package Tray
RoHS Status 1
Price: $8,292.5000
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image of System On Chip (SoC)>18627055
18627055
Model
18627055
Product Category
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Description
IC VERSALPRIME
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.4GHz
RAM Size256KB
Number of I/O500
Operating Temperature0°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
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